But you can also make your own from drill presses and readily available parts: https://www.youtube.com/watch?v=HoSVPHVESiE

for low temp plastic and for resin 3D printers using high temp resin you can even just skip straight to 3D printing the molds with some kind of basic “standardized” mold frame made from metal.

I had an injection molding machine as a kid… a toy of course, but it ticked all the boxes. It was a heated vertical cylinder with a plunger, below that was a slot for a 2-piece plastic mold.The feedstock was a granulated rather waxy material. The procedure was, fill the chamber with measured amount of the granules and put the mold in the slot below. After allowing time for the plastic to melt, you pushed down the plunger to inject it into the mold. It really worked pretty well for a toy. I had molds for tanks and soldiers and construction equipment like bulldozers, and the plastic material in several colors. I wish I could remember what it was called.

The really cool part is you can 3D print a pattern, make a plaster copy using a silicone mold and then cast zinc alloy dies after drying the plaster in the oven for 24 hours and achieve surface finish as good as the 3D print. Subject to details such as pulling a vacuum on the plaster to remove bubbles and other details.

I work with injection moulding machines. This is real cute could I have one to put on a keyring or maybe my car’s rear view mirror. :0)

Certified to ISO 9001: the international standard for quality assurance.(Excluding Bandoh Memorial Research Laboratory and INNOMS Promotion Dept.)

Face down method adoptedDue to thinner semiconductor packages, it is necessary to evenly and uniformly supply resin to panels and wafers with large mold area. By adopting the face down method, we have realized uniform and extremely thin molding even for large mold areas. And compared to the face up method, its superiority is recognized with less warpage generated during molding.

No resin flow allowing thinner wiresWith molding using the compression method, there is virtually no resin flow, which enables the impact on chips and wires to be minimized. It improves the molding quality of package products and permits the use of thinner wires, leading to the reduction of material costs.

Yep, that’s it, Kenner Moldmaster. I had a lot of “maker” kind of toys, Mattel Vac-U-Form and other stuff. Guess I was starting early.

I’ve been planning to make something like this. All the motors and other stuff seem unnecessarily complex, when all it needs to do is: 1) Melt the plastic 2) Make good seal with the mold 3) Apply a lot of force (i.e. my weight) over a few seconds.

Molding technologies are used to seal semiconductors by electrically insulating them from the outside using resin. These technologies are essential to ensure the reliability of semiconductors.

Yeah a lowly arduino and small 16×2 lcd could definitely do the same job but I guess those were the parts they had lying around and wanted to use

TEN-System supports TSS comprehensively with IoT and a web system, allowing us to provide appropriate services promptly.

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Reduced manufacturing process and cleaning-lessThis method reduces the time taken for the overall manufacturing process because it does not require the processes after molding such as backgrinding and chemical mechanical polishing (CMP).In addition, it uses a mold release film, which makes it unnecessary to clean the mold.

The build relies on a pair of beefy 3hp motors to drive the screw-based injection system. These are responsible for feeding plastic pellets from a hopper and then melting them and filling the injection reservoir, before then forcing the hot plastic into the mold. Further stepper motors handle clamping the mold and then releasing it and ejecting the finished part. A Raspberry Pi handles the operation of the machine, and is configured with a custom Python program that is capable of proper cycle operation. At its peak, the machine can produce up to 4 parts per minute.

The key here is automation (well at least for as much of the process as can be practically done). Sure you could absolutely do everything the motors do manually but I have a feeling the goal for this specific project was automation.

Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, End mills and Drills from TOWA boast high precision, superior abrasion resistance, and a long life-span.

Good to see, straightforward to fabricated. Along with titanium 3D printed moulds could be a good mix for smart batches. Thanks for posting :-)

I have a PIM shooter Model 150. I bought it used for $500 and I really like it: https://www.techkits.com/products/model-150a/

Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, End mills and Drills from TOWA boast high precision, superior abrasion resistance, and a long life-span.

The transfer molding method, for which we take advantage of our extensive track record and reliability, and the compression molding method, with which we will respond to future demand for panels and slimmer dimensions.

3D printing is all well and good if you want one of something, but if you want lots of plastic parts that are all largely identical, you should consider injection molding. You can pay someone to do this for you, or, in true hacker fashion, you can build an entire injection molding setup in your own garage, as [Action BOX] did.

TOWA is a leading company in the semiconductor molding equipment market. We offer equipment using our proven transfer molding method, and high quality / flow free compression molding method.

Applicable to large size panels and wafersFor reducing the cost of semiconductor packages, lead frames and substrates sizes are becoming larger, requiring semiconductor manufacturing equipment that is compatible with them.By using our compression technology, it’s possible to mold ultra large panels and offer solutions for industry cost reduction needs ahead of the market.

In semiconductor plastic encapsulation technology, molding can be roughly divided into transfer and compression methods. Since establishing industry standards by developing the world’s first fully automated semiconductor plastic encapsulation equipment with multi plunger, TOWA has been the leading company in the semiconductor molding market. In addition to transfer systems boasting many years of experience, we propose a molding process that stays ahead of the needs of the market with the newly developed compression method as state-of-the-art encapsulation technology.

Material cost reduction with 100% resin efficiencyWith the compression method, liquid or granular resin is put directly into the cavity and then melted before the workpiece is immersed in it for resin molding. This method makes it unnecessary to use a gate or a runner, which are used for the transfer method, and makes the efficiency in the use of resin almost 100%. The compression method contributes greatly to customer’s cost reduction and reduces the amount of waste, which makes it a more environmentally friendly molding technology than ever before.

Our molding technology based on the compression method also reduces the pressure applied to the workpiece, enabling the molding of products made from low-K materials to be optimized.Products such as 3D NAND flash memory, application processors, fingerprint sensors, power devices have been showing growth, and the compression method adapted to those devices has been high valued in the global market as an equipment with stable quality and productivity.

In addition to trading in the global market, we consistently engage in purchase, reclamation, sales, and provision of support, all essential for trading used equipment.

As demand for semiconductors is increasing in areas such as Internet of Things (IoT), self-driving cars, and expansion of data centers due to increase in data volume, devices such as tablets and smartphones are also diversifying.Semiconductor packaging technology is also required to be thinner and more highly integrated. Wafer level package, which is molded omitting the substrate for achieving miniaturization and ultra-thinning, and a molding process that realizes high productivity and cost reduction are also requested. For responding to market needs ahead of others, we have developed a new molding technology based on the compression method.

As the leading company in resin sealing technologies for semiconductors and other electronic components, we at TOWA Corporation have supplied a number of ultra-precision molds to the market. These products have been highly acclaimed by customers.

Me Like! It’s also been running some hours, guessed from the wear on the timing belt @04:15. Also like the home-built mill in the backgound…

As the leading company in resin sealing technologies for semiconductors and other electronic components, we at TOWA Corporation have supplied a number of ultra-precision molds to the market. These products have been highly acclaimed by customers.

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It’s an impressive piece of industrial-type hardware. If you want to produce a lot of plastic things in your own facility, a machine like this is very much the way to go. It’s not the first machine of its type we’ve seen, either! Video after the break.

That’s pretty slick. I’ve been wanting to build one of these for a while now, and it’s good to see such a great DIY concept model.

Transfer molding is a conventional method of plastic encapsulation of electronic components, such as semiconductors, with which the cavity is filled with melted resin by using a plunger.The multi plunger system that supplies resin from multiple holes when injecting resin into the cavity is a molding method that we developed in the early years, in addition to a drastic improvement in resin use efficiency and significant improvement in molding quality, it made it possible to greatly shorten the resin molding cycle, being highly valued all over the world.Due to the reliability and achievements of our transfer molding method which became the de facto standard, it has been adopted for a large number of products to date and by making use of this extensive accumulated know-how, we provide optimal solutions for our customers.

I had one of these. It went the way of many of my toys, but I found a replacement on eBay a few years ago. Unfortunately, the molds were warped to the point where they won’t work any more, so I’ll have to make some new molds in order to play with it. The molds were made of what looks like nylon, and the plastic that was injected I think was a blend of polypropylene and paraffin that melts at a pretty low temperature (similar to what is sometimes called “carving wax”), but still, using thermoplastic molds to mold thermoplastics is kind of iffy.

With our expertise in the field of singulation, high speed handling and image analysis technology, we offer high quality singulation equipment.